GB Electronics

12th June 2024

Tech Spotlight: PCB Design Innovation
We’re thrilled to announce the completion of our most complex 12-layer PCB design to date. πŸ” Key features: β€’ Comprehensive connectivity with 1192 separate nets. β€’ Precision placement of 1606 components, from passive devices to complex ICs. β€’ Advanced signal routing for optimal data transfer rates and minimal latency. β€’ Signal integrity preserved through strategic use of microvias and buried vias. β€’ Efficient FPGA breakout strategy for high-pin-count packages. This achievement marks a significant milestone in our commitment to innovation and excellence. Ready to elevate your projects? Contact us to explore possibilities! πŸ“§ Email: πŸ“ž General: +44 (0) 1903 216 646 #GBE #ElectronicsDesign #PCBDesign #ElectronicsInnovation